镁合金电镀前处理中用什么代替氢氟酸以及含氟的物质

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This method produces a protective copper film on magnesium alloy and improve adhesion between copper film and magnesium alloy substrate without pretreatment in other electrolyte like zincate process. In pyrophosphate based electrolyte 0.4M Na4P2O7 + 0.08M Cu2P2O7 + 0.24M CuSO4 + 0.05M NaF displacement reaction occurred between copper and magnesium, then copper film formed on magnesium substrate. After copper displacement film formed, electroplating carried out applying DC and pulse current in the same electrolyte.